Massachusetts Veterans Jobs

MassHire JobQuest Logo

Job Information

MIT Lincoln Laboratory Process Integration Engineer in Lexington, Massachusetts

The Microelectronics Laboratory is seeking a process integration engineer to apply their science or engineering skills fabricating state-of-the-art superconducting circuits, quantum computing, radiation hardened electronics, charge coupled imagers and more.

Job Description

As part of a Process Engineering team, the successful candidate will sustain and support assigned base processes and tool capabilities, customizing process for programs and integrate them into full flow device and circuit fabrication. Focus areas could include photolithography, reactive ion etch, plasma enhanced chemical vapor deposition, physical vapor deposition, wafer bonding, wet chemical processing and ion implantation. For the successful candidate's assigned area, the person will:

  • Develop process modules and layers in support of program needs, working through integration issues and enabling program device/circuit designers to work on higher level design and integration issues

  • Maintain and improve process capability, lot quality, and operations efficiency,

  • Define and implement statistical process control; Respond to process shifts, excursions, misprocess events, and tool downs,

  • Create and maintain required process procedures and documentation,

  • Work with maintenance to maintain and improve equipment performance and capability.

Requirements

  • BS degree,in relevant engineering, or science curricula

  • Enthusiasm for solving problems and a willingness to work in a cleanroom

  • 10+ years of experience in microfabrication or other manufacturing environment

  • Knowledge and experience in one or more of the following process areas is preferred: plasma enhanced chemical vapor deposition (PECVD), thin film metal deposition, chemical mechanical polish (CMP), ion implantation, reactive ion etch, wet processing, low pressure chemical vapor deposition (LPCVD), thermal oxidation, lithography, silicon wafer thinning, or wafer bonding

  • Skills in process integration for micro- or nanofabrication, metrology equipment use, statistical process control, and design of experiments

  • Strong written and verbal communication skills

  • Ability to work and interact effectively with a wide spectrum of people, including technicians, unit process engineers, technical staff, and specialists

    Preferred Qualifications:

    • MS degree,in relevant engineering, or science curricula;

    • Experience developing and customizing fabrication processes for device or circuit development in prototyping or new product development

For Benefits Information, click http://hrweb.mit.edu/benefits

Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance.

MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.

Requisition ID: [[id]]

DirectEmployers